#191-7, Suwolam-Ri, Seotan-Myeon, Pyeongtaek-Si, Gyeonggi-Do, Korea, Korea (South)
+82-31-665-9783/4
We, Hi-Tech Korea Co., Ltd., wants to be recognized as a customer oriented and competitive price supplier than other competitors.
Our products will satisfy our customers with proven quality and with pro-active technical services.
We will be a one of best brand of electrochemical products and electrochemcal industry.
We will develop products by training our personnel and providing them with good working environment and education and become well known electrochemical products manufacturer.
We will become best partner to share success in this industry together with our customers.
We will put our effort to make it happen.
Our major customers are as followings :
01) Nokia (Finland)
02) Sony (Japan)
03) Hitachi (Japan)
04) Philips (Netherands)
05) Thomson (France)
06) Alps (Japan)
07) Delta (Taiwan)
08) BenQ (Taiwan)
09) Li Shin International Enterprise Corporation (Taiwan)
10) Feng Chang (Taiwan)
11) TCL (China)
12) Samsung Electronics (Korea)
13) LG Electronics (Korea)
14) Hyundai Motor & Kia Motor (Korea)
15) Daewoo Electronics (Korea)
16) SMT (Hong Kong)
17) Yokogawa (Japan)
18) LG-Philips LCD (Korea)
19) Samsung SDI (Korea)
20) Samsung Electro-Mechanics (Korea)
21) LG Innotek (Korea)
22) Microsoft (USA)
23) Samsung SDI (Korea)
24) LG Chem (Korea)
25) Motorola (USA)
26) Foxlink (Taiwan)
27) Humax (Korea)
28) Hynix Semiconductor (Korea)
29) Pantech (Korea)
30) Hewlett Packard (USA)
31) Dell (USA)
32) Sanyo (Japan)
33) Mitsumi (Japan)
SMT GLUE // Glue for I. C. Excusive Use (For CD-ROM / DVD-ROM) // One Component Epoxy for Preventing IC and Chip Falling-Off by Outer Impact // Coil Fixing Glue (For All Kinds of Tuner) // Feelable Solder Masking Ink // One Component Epoxy for Adhesion and Molding (Dam&Fill, COB) // One Component Epoxy for Camera Lens and Camera Module // Two Component Epoxy for Security of Circuit Module from Industrial Spy and Prevention of Circuit Module from Electric Short // One Component Epoxy for Smart Card // Underfill Resin for BGA & CSP or Flip Chip devices